Date: 3.9.20
Location: Logan High School
Time: 12:00-2:00 PM
Goals: AMP chip circuit design, continue working on the
sensor/circuit board housing design.
Students: Tommy, Abie, Clara, Rebecca, Sam, Ella
We continued working on the housing for the sensors and
circuit boards today with plans to 3D print the design. Abie and Rebecca are
looking at a design where the circuit board slides into the housing. Hose and
wires will be routed out on opposite sides of the enclosure.
Clara, Ella and Tommy
began working on the circuit and design for the AMP Chip (LMV 321). The
purpose of this circuitry is to boost the signal so the software can better
define its resolution. This process included soldering 5 small wires together
onto the chip. It was a very long and tedious task because everything is very
small. We decided to order a bread board to hold the chip in place that will
make the surface mount process easier. We will order a surface mount board for
next week to speed this up. It is taking too long to solder the surface mount
chips.
On the software side of things, Sam started working on
getting an output to an app which he was successful in doing on a small scale.
Now he needs it to be displayed in a graphically pleasing form on the App.
Next week we will work on getting some readings with the
sensors in a pack and getting some pressure on them. We will also try out the
3d printed housings.
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| Tommy working on Multisim for the AMP circuit design. |
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| Abie and Rebecca working on designing the circuitry housing. |
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| Clara learning to solder surface mount. |
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| Some fine soldering work. |
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